Thermal Conductive Potting Compound Using Guide: Accurate operation procedure & Key precautions
1. Preparations: Establishing a solid base for encapsulation
Thermal conductive encapsulation adhesive is prone to material stratification when stored for a long time. Before use, it is necessary to thoroughly mix the adhesive using a manual or mechanical mixer to ensure uniformity without sedimentation or stratification. At the same time, the working environment must be kept clean and dry. Dust, impurities, and moisture in the working area should be removed to prevent contaminants from mixing into the adhesive and affecting the sealing and bonding performance.
2. Mixing and Injection: Precise control of details
The accurate proportion of each component is the key to ensuring the stability of the adhesive performance. According to the requirements of the product specification, the weighing error must be strictly controlled. After mixing the components in proportion, use a dedicated mixing tool to stir at a uniform speed until the mixture has a uniform color, no obvious color difference, and no particle sensation. During injection, either mechanical injection or manual pouring can be used to evenly cover the key areas of electronic components and circuit boards. Pay attention to the edges and gaps to ensure no omissions and no air bubbles. If necessary, apply a moderate amount of pressure to assist in eliminating air bubbles, further enhancing the sealing density.
3. Curing Process: Ensuring performance
Curing is the final process for forming the protective performance of the thermal conductive encapsulation adhesive. Depending on the type of adhesive (such as room temperature curing or heating curing), strictly follow the set curing temperature and time as specified in the product manual. When heating curing, use a constant temperature device to accurately control the temperature to avoid excessive temperature damage to the adhesive molecular structure or insufficient curing due to low temperature. At the same time, ensure sufficient curing time and prohibit premature removal of the mold or immediate use to ensure complete cross-linking and curing of the adhesive, achieving excellent thermal conductivity, insulation, and protective performance.
To avoid sealing defects and ensure product reliability, the following key points need to be paid attention to during use:
1）Strictly control the shelf life: Before use, check the product's shelf life and strictly prohibit the use of expired adhesive. Avoid problems such as poor curing and adhesive failure due to performance degradation.
2）Standardize storage conditions: Store in a cool, dry, and sealed environment, away from direct sunlight and high-temperature heat sources, to prevent material stratification and deterioration of the adhesive.
3） Accurately measure the curing agent: The dosage of the curing agent directly determines the curing speed and the performance of the cured product. It is necessary to weigh it strictly according to the proportion specified in the manual to avoid overuse or underuse, ensuring a sufficient and stable curing reaction.
4） Ensure thorough mixing: During mixing, control the speed and duration to ensure uniform mixing of all components, avoiding incomplete curing and uneven performance due to uneven mixing in some areas.
5） Maintain a stable curing environment: During the curing process, keep the temperature constant to avoid temperature fluctuations that cause uneven curing; if it is a light-colored cured product, choose an environment with low ultraviolet exposure or take shading measures to prevent yellowing and aging of the color.
In conclusion, strictly following the standard usage procedures and precautions for thermal conductive encapsulation adhesives can effectively avoid common problems such as bubbles, poor curing, and performance degradation, providing comprehensive insulation, moisture-proofing, thermal conductivity, and protection for electronic components. This not only enhances the overall reliability of electronic products but also extends their service life and ensures long-term stable operation.
