TIF800SE High Thermally Conductive 15W/MK Soft Thermally Conductive Gap Filler Pads For Electronic Components IC, CPU, MOS

TIF^®800SE High Thermally Conductive 15W/MK Soft Thermally Conductive Gap Filler Pads For Electronic Components IC, CPU, MOS

 Product descriptions

The TIF^®800SE Series is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness.This unique performance balance allows it to efficiently handle the cooling challenges posed by extremely high heat fluxes,kwhile álso possessing good mechanical_strength and compressibility, making it easy to manufacture and install. It provides a thermal interface material solution with both outstanding heat dissipation performance and high reliability for high-power-density electronic devices.

Features

> Excellent thermal conductive 15.0W/mK
> Good softness and filling properties
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance

Application

> Cooling components to thechassis of frame
> Set Top Box
> Car Battery & Power Supply
> Charging Pile
> LED Tv/ Lighting
> Graphics Card Thermal Module

> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

Product Specification

Product Thicknesses: 0.030"(0.75mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Vietnam Ziitek Technology Company Limited is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.