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घर > उत्पादों > तापीय गद्दी > TIF100-15-11F Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection

TIF100-15-11F Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection

उत्पाद का विवरण

उत्पत्ति के प्लेस: वियतनाम

ब्रांड नाम: Ziitek

प्रमाणन: UL and RoHs

मॉडल संख्या: टीआईएफ100-15-11एफ

भुगतान और शिपिंग की शर्तें

न्यूनतम आदेश मात्रा: 1000 पीसी

मूल्य: 0.1-10 USD/PCS

पैकेजिंग विवरण: 24*13*12 सेमी डिब्बों

प्रसव के समय: 3-5 कार्य दिवस

भुगतान शर्तें: टी/टी

आपूर्ति की क्षमता: 100000pcs/दिन

सबसे अच्छी कीमत पाएं
प्रमुखता देना:
उत्पाद का नाम:
थर्मल प्रवाहकीय सिलिकॉन थर्मल पैड हीट सिंक अनुप्रयोगों और इलेक्ट्रॉनिक डिवाइस सुरक्षा के लिए उपयुक्त
प्रकार:
1.5W/mk
घनत्व:
2.2 ग्राम/सेमी³
कीवर्ड:
थर्मल पैड
रंग:
अंधेरे भूरा
कठोरता:
65/60 किनारा 00
ढांकता हुआ ब्रेकडाउन वोल्टेज (वी/मिमी):
≥5500
आवेदन:
हीट सिंक अनुप्रयोग और इलेक्ट्रॉनिक उपकरण सुरक्षा
नमूना:
मुक्त
उत्पाद का नाम:
थर्मल प्रवाहकीय सिलिकॉन थर्मल पैड हीट सिंक अनुप्रयोगों और इलेक्ट्रॉनिक डिवाइस सुरक्षा के लिए उपयुक्त
प्रकार:
1.5W/mk
घनत्व:
2.2 ग्राम/सेमी³
कीवर्ड:
थर्मल पैड
रंग:
अंधेरे भूरा
कठोरता:
65/60 किनारा 00
ढांकता हुआ ब्रेकडाउन वोल्टेज (वी/मिमी):
≥5500
आवेदन:
हीट सिंक अनुप्रयोग और इलेक्ट्रॉनिक उपकरण सुरक्षा
नमूना:
मुक्त
TIF100-15-11F Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection

Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection

 

The TIF®100-15-11F Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat,and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.

 
Features:


> Good thermal conductivity 1.5W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications:


> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

 

Typical Properties of TIF®100-15-11F Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.2 ASTM D792
Thickness Range(inch/mm)

0.010~0.020

0.25~0.50

0.030~0.200

0.75~5.00

ASTM D374
Hardness (Shore 00) 65 60 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1Mhz 4.5 ASTM D150
Volume Resistivity(Ohm-cm) >1.0X1012  ASTM D257
Thermal Conductivity (W/m-K) 1.5 ASTM D5470
1.5 ISO22007
Fire rating V-0 UL 94 (E331100)
 
Product Specifications
Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF100-15-11F Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection 0

Company Profile

 

Vietnam Ziitek Technology Company Limited (ZIITEK) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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