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घर > उत्पादों > तापीय गद्दी > TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

उत्पाद का विवरण

उत्पत्ति के प्लेस: वियतनाम

ब्रांड नाम: Ziitek

प्रमाणन: RoHS

मॉडल संख्या: TIF100-32-05U

भुगतान और शिपिंग की शर्तें

न्यूनतम आदेश मात्रा: 1000 पीसी

मूल्य: 0.1-10 USD/PCS

पैकेजिंग विवरण: 24*13*12 सेमी डिब्बों

प्रसव के समय: 3-5 कार्य दिवस

भुगतान शर्तें: टी/टी

आपूर्ति की क्षमता: 100000pcs/दिन

सबसे अच्छी कीमत पाएं
प्रमुखता देना:
उत्पादों का नाम:
एआई सर्वर, जीपीयू कूलिंग, इन्वर्टर के लिए अल्ट्रा सॉफ्ट थर्मल सिलिकॉन पैड 3.2W उच्च चालकता गैप फिलर
सामग्री:
सिरेमिक से भरा सिलिकॉन इलास्टोमर
ऊष्मीय चालकता:
3.2W/mk
घनत्व(ग्राम/सेमी³):
3.0
आवेदन:
एआई सर्वर, जीपीयू कूलिंग, इन्वर्टर
कठोरता:
27 शोर 00
रंग:
नीला
फ्लेम रेटिंग:
94 V0
नमूना:
नमूना मुक्त
कीवर्ड:
थर्मली सिलिकॉन पैड
उत्पादों का नाम:
एआई सर्वर, जीपीयू कूलिंग, इन्वर्टर के लिए अल्ट्रा सॉफ्ट थर्मल सिलिकॉन पैड 3.2W उच्च चालकता गैप फिलर
सामग्री:
सिरेमिक से भरा सिलिकॉन इलास्टोमर
ऊष्मीय चालकता:
3.2W/mk
घनत्व(ग्राम/सेमी³):
3.0
आवेदन:
एआई सर्वर, जीपीयू कूलिंग, इन्वर्टर
कठोरता:
27 शोर 00
रंग:
नीला
फ्लेम रेटिंग:
94 V0
नमूना:
नमूना मुक्त
कीवर्ड:
थर्मली सिलिकॉन पैड
TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

  

The TIF®100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Features:
 

> Good thermal conductivity: 3.2W/mK

> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Easy release construction
> Electrically isolating
> High durability


Applications

 

> AI Servers, Inverters, Telecom Devices

> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems

> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power

 

Typical Properties of TIF®100-32-05U Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm)

0.010~0.020

(0.25~0.50)

0.030~0.200 (0.75~5.0) ASTM D374
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 3.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.2 W/m-K ASTM D5470
3.2 W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.010"(0.250 mm)-0.20" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)


Component Codes:


Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

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