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घर > उत्पादों > तापीय गद्दी > TIF500-50-10U Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material

TIF500-50-10U Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material

उत्पाद का विवरण

उत्पत्ति के प्लेस: वियतनाम

ब्रांड नाम: Ziitek

प्रमाणन: RoHS

मॉडल संख्या: TIF500-50-10U

भुगतान और शिपिंग की शर्तें

न्यूनतम आदेश मात्रा: 1000PCS

मूल्य: 0.1-10 USD/PCS

पैकेजिंग विवरण: 24*13*12 सेमी डिब्बों

प्रसव के समय: 3-5 कार्य दिवस

भुगतान शर्तें: टी/टी

आपूर्ति की क्षमता: 100000pcs/दिन

सबसे अच्छी कीमत पाएं
प्रमुखता देना:
उत्पाद का नाम:
सॉफ्ट हीट डिसिपेशन गैप फिलर थर्मल कंडक्टिव सिलिकॉन पैड जीपीयू सीपीयू एलईडी थर्मल इंटरफ़ेस सामग्री
विशिष्ट गुरुत्व:
3.2 ग्राम/सीसी
आवेदन:
एआई प्रोसेसर एआई सर्वर
कीवर्ड:
नरम थर्मल पैड
कठोरता:
20 किनारे 00
ऊष्मीय चालकता:
4.0w/mk
नमूना:
नमूना मुक्त
रंग:
अंधेरे भूरा
फ्लेम रेटिंग:
94 V0
सामग्री:
सिरेमिक से भरा सिलिकॉन इलास्टोमेर
उत्पाद का नाम:
सॉफ्ट हीट डिसिपेशन गैप फिलर थर्मल कंडक्टिव सिलिकॉन पैड जीपीयू सीपीयू एलईडी थर्मल इंटरफ़ेस सामग्री
विशिष्ट गुरुत्व:
3.2 ग्राम/सीसी
आवेदन:
एआई प्रोसेसर एआई सर्वर
कीवर्ड:
नरम थर्मल पैड
कठोरता:
20 किनारे 00
ऊष्मीय चालकता:
4.0w/mk
नमूना:
नमूना मुक्त
रंग:
अंधेरे भूरा
फ्लेम रेटिंग:
94 V0
सामग्री:
सिरेमिक से भरा सिलिकॉन इलास्टोमेर
TIF500-50-10U Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material

TIF500-50-10U Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material

 

Product descriptions

 

TIF®500-50-10U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:

 

> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> RoHS compliant
> UL recognized


Applications:

 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure

 

Typical Properties of TIF®500-50-10U Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

TIF500-50-10U Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material 0

 

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
 
Component Codes:
 
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF500-50-10U Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material 1

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

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