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घर > उत्पादों > तापीय गद्दी > TIF100-65-11U Exceptional Thermal Conductivity Rating Of 6.5W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers

TIF100-65-11U Exceptional Thermal Conductivity Rating Of 6.5W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers

उत्पाद का विवरण

उत्पत्ति के प्लेस: वियतनाम

ब्रांड नाम: Ziitek

प्रमाणन: RoHS

मॉडल संख्या: टीआईएफ100-65-11यू

भुगतान और शिपिंग की शर्तें

न्यूनतम आदेश मात्रा: 1000 पीसी

मूल्य: 0.1-10 USD/PCS

पैकेजिंग विवरण: 24*13*12 सेमी डिब्बों

प्रसव के समय: 3-5 कार्य दिवस

भुगतान शर्तें: टी/टी

आपूर्ति की क्षमता: 100000pcs/दिन

सबसे अच्छी कीमत पाएं
प्रमुखता देना:
उत्पाद का नाम:
एआई प्रोसेसर एआई सर्वर के लिए 6.5W/MK सिलिकॉन-आधारित थर्मल गैप पैड फिलर की असाधारण थर्मल चालकता रेटि
आवेदन:
एआई प्रोसेसर एआई सर्वर
कठोरता:
65/27 तट 00
आवेदन:
3.4G/CC
नमूना:
नमूना निःशुल्क
प्रकार:
6.5w/mk
सामग्री:
सिरेमिक से भरा सिलिकॉन इलास्टोमेर
लौ रेटिंग:
94 V0
रंग:
अंधेरे भूरा
कीवर्ड:
सिलिकॉन आधारित थर्मल गैप पैड
उत्पाद का नाम:
एआई प्रोसेसर एआई सर्वर के लिए 6.5W/MK सिलिकॉन-आधारित थर्मल गैप पैड फिलर की असाधारण थर्मल चालकता रेटि
आवेदन:
एआई प्रोसेसर एआई सर्वर
कठोरता:
65/27 तट 00
आवेदन:
3.4G/CC
नमूना:
नमूना निःशुल्क
प्रकार:
6.5w/mk
सामग्री:
सिरेमिक से भरा सिलिकॉन इलास्टोमेर
लौ रेटिंग:
94 V0
रंग:
अंधेरे भूरा
कीवर्ड:
सिलिकॉन आधारित थर्मल गैप पैड
TIF100-65-11U Exceptional Thermal Conductivity Rating Of 6.5W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers

Exceptional Thermal Conductivity Rating Of 6.5W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers

 

Product descriptions

 

The TIF®100-65-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit, It issuitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Features:


> Good thermal conductive: 6.5W/mK

> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Easy release construction
> Electrically isolating
> High durability


Applications:


> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

 

Typical Properties of TIF®100-65-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.5 W/m-K ASTM D5470
6.5 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16" X16" (406 mmX406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF100-65-11U Exceptional Thermal Conductivity Rating Of 6.5W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

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